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LEC-2010 Fanless Embedded System User’s Manual

1.3 Specifications

Feature Description

Form Factor Fanless Embedded System

Processor Onboard Intel® Atom™ 1.6 GHz

Chipset Intel 945GSE+ICH7M

Platform

BIOS AMIBIOS with 8Mbit BIOS Flash

Technology 533 MHz DDR2 SDRAM

Socket 200P SODIMM x1

Onboard Memory 1GB DDR2 onboard

System Memory

Maximum Capacity 2GB (1GB DDR2 onboard + 1GB DDR2 module)

CompactFlash I/II 1

Storage Interface

SATA Port 2

VGA D-Sub 15-pin connector

Display

Interface

DVI-D

Audio

Codec ALC888 HD Codec

Lan Ports 2

Networking

Speed 10/100/1000 Mbps

Digital I/O DB9 Female 4 in 4 Out

USB 2.0 6 (Total: 7; External x 6 , Internal x 1)

LAN 2 x RJ45 GbE

Front I/O

Mic In / Line Out 1/1

COM RS-232 x 4; RS-232/422/485 selectable x 2 ports(COM2& 3)

DVI 1

Rear I/O

VGA 1

Internal I/O

USB 2.0 1 (Pin header)

Expansion

Lan Ports PCI x 1 (LEC-2010P)

Lan Ports PCIe x 1 (LEC-2010E)

Speed Mini-PCIe x 1

Controller Winbond W83627UHG integrated hardware monitor

Hardware

Monitoring

Watchdog timer Reset supported, 1~255 level

Linux kernel 2.4.16 or above, XPE/Win

OS Supported

XP-32 bit, Win CE 6.0

-5~45°C (with 2.5” commercial HDD)

-10°~55°C (with industrial components - CF card, HDD,

Memory, adapter)

Extended Operating Temperature:

-20°C: 24 hours bootable;

Temperature, ambient

operating

70° C: 72 hours fu ll-loading operating

Humidity (RH), ambient

operating

10~95% relative humidity, non-condensing

Environmental

Parameters

Storage Temperature -20°~80°C

Mounting Wall mounting kit

Dimensions 268(W) x 65(H) x 190(D) Physical Dimension s

Net Weight 2.6Kg

Input DC +9V~36V (ATX Mode)

Power

Adapter 75W (+19V)

Note: All specifications and images are subject to change without notice.

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